Laser Applications Conference Panels

LAC is an all-invited speaker format for industry in laser applications. For 2026, the LAC panels will focus on laser applications across a broad range of fields. The LAC Technical Committee is organizing approximately ten panels. Confirmed panels are listed below. 

Additive Laser-Based Processing: From Large Scale to Micro Nano Material Processing 

Organizer: Maria Farsari, IESL-FORTH, Greece

Laser-driven additive manufacturing is opening new possibilities in advanced production by delivering exceptional precision, adaptability and scalability. This session will cover the latest progress in laser processing technologies, focusing on process optimization, calibration, real-time monitoring and micro/nano fabrication techniques. Participants will explore how mask-free, high-resolution laser methods can produce intricate 2D, 2.5D, and 3D architectures across diverse materials, ranging from nanoscale features to large-area structures.

The session will further examine hybrid manufacturing strategies that merge additive, subtractive and ablative laser processes, enabling levels of geometric complexity and design flexibility unattainable with conventional fabrication methods. Depending on the laser system and material combination, these technologies can generate functional surfaces, advanced structures and nanoparticles for a wide variety of applications. 

Invited Speakers
Jonas Grünewald, Technische Universität Munchen. Germany 
Beam Shaping and Additive Manufacturing

Mangirdas Malinauskas, Vilniaus Universitetas, Lithuania
High Performance Microoptics realized via MPL

Christophe Moser, École Polytechnique Fédérale De Lausanne, Switzerland
Volumetric 3D Printing

Paul Somers, Karlsruher Institut für Technologie, Germany
Temporal-focusing 2PP and 3D Holographic Multiphoton Printing

 

Free Space Communications and Space 

Organizer: Helena Diez, Optica, UK

Free-space and optical wireless communications offer the potential for high-capacity, secure data transmission across terrestrial, underwater, airborne and space networks. Realizing this potential requires advances throughout the optical link, including laser sources, fiber-coupled transmitters and receivers, beam steering, pointing and tracking, adaptive optics, turbulence sensing and optical ground infrastructure.

This session will examine emerging technologies and practical challenges affecting satellite-to-ground, inter-satellite and other demanding optical links. Contributions will address atmospheric and underwater propagation, real-time turbulence compensation, efficient single-mode-fiber coupling, miniaturized fiber-integrated optics, terminal performance and link modeling. A panel of experts from academia, research organizations, and industry will discuss the pathway from laboratory demonstrations to reliable, scalable and operational communication systems.

Invited Speaker
Martynas Adomaitis, OPTOMAN, Lithuania
Title to be Announced

Yves Bellouard, École Polytechnique Fédérale de Lausanne, Switzerland
Title to be Announced

Sanin Zulic, InnoLas Laser GmbH, Germany
Title to be Announced

Alvydas Zabolis, EKSMA Optics,
Lithuania Title to be Announced

 

Fusion Energy

Organizer: Franck Leibreich, THALES, France

Nuclear fusion is a real clean energy source compared to fossil fuels or nuclear fission. Since the first nuclear fusion reaction realized by laser at the Lawrence Livermore National Laboratory (LLNL) back in 2022 and the availability of high-energy, high-power industrial lasers, several laser fusion industrial private companies have appeared in this field. This panel aims to provide an overview of the Laser Fusion through those companies and their challenges in the future.

Invited Speaekers
Thomas Forner, Focused Energy GmbH, Germany 
Title to be Announced

Jana Jung, Marvel Fusion GmbH, Germany 
Title to be Announced

Paul Rudy, Blue Laser Fusion Inc, USA 
Title to be Announced

 

Global Security and Aerospace

Organizer: Sandra Biedron, Element Aero and the Center for Bright Beams, USA

High-energy and high-intensity continue to mature and have myriad applications related to security and defense. This session will provide an overview of applications, such as directed energy, remote sensing,  securing the microelectronics supply chain, wavelength accessibility and aspects of unique user-accessible facilities for collaborative research and development. The session will also explore aspects of the workforce as well as supply chain for this unique sector of lasers and peripherals for global security.

Invited Speakers
John Dominik, Hades Mining GmbH, Germany 
Drilling Hard Rock with High-Power Fiber Lasers

Erik Hosler, OBSIDIA Semiconductors, USA 
Title to be Announced

Mikhail Polyanskiy, Brookhaven National Laboratory, USA 
High-Peak Power LWIR Lasers for Directed Energy Applications

Remigijus Sliupas, OPTOMAN, Lithuania 
Title to be Announced

 

Laser-Beam Delivery and Beam Manipulation of High-Power Laser Beams

Organizer: Titas Gertus, Toolas, Lithuania

The relentless push toward higher power levels and ultra-short pulse durations in industrial laser systems is opening exciting new frontiers - while pushing beam delivery infrastructure to its limits. As peak power climbs, traditional optical components struggle with severe thermal loads and nonlinear effects that degrade beam quality and cause catastrophic component damage.

This session bridges theory and practice to explore how current technologies meet the rigorous demands of modern laser processing. A panel of academic and industry pioneers will showcase innovative materials, adaptive optics and novel beam-shaping techniques engineered to overcome these hurdles, ensuring flawless, precise and efficient light delivery for the most demanding applications.

Invited Speakers
Sabina Kuprėnaitė, OPTOMAN, Lithuania 
Non-degrading IBS-coated Optics for High-power Beam Delivery from UV to NIR

Lina Grineviciute, Ctr for Physical Sciences & Technology, Lithuania 
Nanostructured Coatings for High-power Laser Optics: Waveplates, Polarizers and Diffractive Elements

Andrius Melninkaitis, Vilniaus Universitetas, Lithuania 
Title to be Announced

Deividas Macius, Beamera, Lithuania and Switzerland 
How to Choose a Beam Expander for High Power Ultrafast Beams

 

Lasers for Biomedical Applications

Organizer: Simas Sobutas, Light Conversion, Lithuania

Laser technologies continue to transform biomedical science and healthcare, enabling breakthroughs in diagnosis, imaging and therapy. This panel will explore how advances in laser sources, beam delivery and ultrafast laser processing are expanding the frontiers of medicine. Topics will include ophthalmic applications ranging from refractive surgery to retinal treatment, precision laser ablation and modification of bone and hard tissues and emerging laser-based imaging techniques that provide unprecedented insight into biological structures and dynamics. The discussion will bring together experts from academia, medicine and industry to examine current clinical impact, technical challenges and future opportunities for translating photonic innovations into improved patient outcomes.

Invited Speakers
Mihaela Balu, UC Irvine Beckman Laser Institute, USA 
Advances in Multiphoton Microscopy for Clinical Imaging

Marie Groot, Vrije Universiteit Amsterdam, Netherlands 
Clinical Translation of Higher Harmonic Generation Microscopy

Stephanie Joachim, Ruhr-University Eye Hospital, Germany 
LIRIC: From Preclinical Development to Clinical Translation of Laser-induced Refractive Index Change

Achim Lenenbach, Fraunhofer-Institut Für Lasertechnik, Germany 
Hard Tissue Laser Surgery

Luca Labate, Consiglio Nazionale Delle Ricerche  Italy 
Development of Compact, Laser-driven Accelerators for Novel Radiotherapy Modalities with VHEE Beams

 

Laser Processing for Next Generation Electronic Devices

Organizer: Bogusz Stępak, Fluence Technology Sp. z o.o., Poland

The continuous drive toward miniaturization and higher performance in the semiconductor industry is pushing traditional manufacturing techniques beyond their limits. As electronic components shrink and advanced packaging becomes increasingly complex, ultrafast laser material processing has emerged as an essential solution, providing extreme precision in applications like high-density microvia drilling or through-glass via (TGV) formation.

This session explores how laser technologies are successfully overcoming critical manufacturing challenges in cutting-edge microelectronics. The discussion will highlight how innovations in laser sources and beam delivery enable the processing of glass, SiC, sapphire and other relevant substrates with exceptional quality and high throughput.

Invited Speakers 
Rondepierre Alexandre, Mitsubishi Electric Adv Tech R&D Center, Japan 
Advanced Laser Processing Solutions to Enable Next-Generation Packaging: GHz-Burst-Mode Picosecond DUV Microvia Drilling in ABF

Maurice Clair, Fluence Technology Sp. Z O.O., Poland 
From Full-Field to Single-Spot – Laser-Based processing for Microelectronics

Daniel Schwab, GFH GmbH, Germany
Ultrafast Laser Solutions: Challenges and Trade-Offs in Microelectronic Applications

Valdemar Stankevic, Ctr for Physical Sciences & Technology, Lithuania
Title to be Announced

Modestas Vainoris, Workshop of Photonics, Lithuania
Next Steps in Laser Processing of Glass to Address AI Needs

 

ML/AI for Laser Materials Processing

Organizer: Thomas Grünberger, Plasmo Industrietechnik GmbH, Austria

The session covers machine learning and artificial intelligence methods and their value in the areas of process development and process monitoring. Key areas to be covered inlcude supervised and unsupervised learning methods, reinforcement learning, generative AI/deep learning, agentic AI, descriptive, diagnostic, predictive and prescriptive data science, applications in process development, quality inspection, predictive maintenance and advisory systems. 

Invited Speakers
Markus Bohrer, Dr. Bohrer Lasertec GM Austria 
Machine Learning for Excellence in Laser Depaneling of Selected Material

Fedor Chernikov, University of Southampton, UK 
Deep Learning Enabled Coherent Beam Combinaiton

Christoph Franz, 4D Photonics GmbH, Germany 
ML/AI for Process Monitoring

Matteo Moscatelli, Politecnico Di Milano, Italy 
AI-Assisted Autonomous Trajectory Planning for Vision-Guided Robotic Laser Welding Applications

Henrik Tünnermann, DESY, Germany 
Physics-informed AI for Ultrafast Optical Thin-film Coating Design

 

Surface Modification & Micromachining

Organizer: Titas Gertus, Toolas, Lithuania

Laser surface modification offers an unparalleled level of precision, providing control that conventional processing techniques simply cannot replicate. From component hardening to advanced texturing for optimized adhesion, lasers allow for the meticulous tailoring of surface topology. Furthermore, emerging multiplexing and interference techniques are successfully scaling these high-precision processes to large-area surfaces. This session will explore the latest advancements in laser capabilities, scanning technologies and micro-structuring processes driving tomorrow’s emerging market applications.

Invited Speaker
Simas Butkus, Light Conversion, Ltd., Lithuania
Title to be Announced

Tadas Kildusis, Akoneer, Uab, Lithuania 
Manufacturing of Copper Traces for Semiconductors and Electronics Using SSAIL Technology