Alcyon Photonics, CCRAFT, and izmo Microsystems Form Strategic Partnership to Advance Next Generation Integrated Photonics Solutions
About Optica
02 June 2026
Alcyon Photonics, CCRAFT, and izmo Microsystems Form Strategic Partnership to Advance Next Generation Integrated Photonics Solutions
Tri party collaboration to jointly design, manufacture, and commercialize advanced integrated and TFLN based photonic systems for datacom, telecom, aerospace, and sensing applications.
Madrid (Spain) / Neuchâtel (Switzerland) / Bengaluru (India), 2nd June 2026 — Alcyon Photonics SL, CCRAFT SA, and izmo Microsystems Private Limited today announced the signing of a Memorandum of Understanding (MoU) establishing a strategic partnership to accelerate the development and commercialization of next‑generation integrated photonics solutions, based on thin‑film lithium niobate (TFLN).
The collaboration brings together three complementary partners spanning the full integrated photonics value chain — from IP and system‑level design through wafer‑scale manufacturing to advanced packaging and system integration. Under the MoU, the partners will jointly address growing demand for high‑performance photonic integrated circuit (PIC) solutions across datacom, telecom, aerospace, sensing, and emerging computing applications.
Reflecting the design‑to‑high-volume-manufacturing focus of the partnership, Jimena García-Romeu, CEO of, Alcyon Photonics, noted that early alignment across the entire value chain is essential for scalable deployment.
“By closely integrating design with fabrication and packaging considerations from the outset, this collaboration allows our customers to move seamlessly from concept to production. It enables us to deliver robust, high‑performance, high-volume-manufacturable integrated photonics solutions with reduced complexity and time‑to‑market.”
At the manufacturing level, CCCRAFT SA, based in Switzerland and spun out of CSEM (the Swiss Centre for Electronics and Microtechnology), contributes its ISO‑certified 150‑mm wafer foundry specializing in TFLN‑based integrated photonics. CCRAFT is among a select group of global providers capable of producing high‑performance TFLN devices at scale.
Hamed Sattari, CEO of CCRAFT SA, emphasized the industrial vision behind the partnership:
“For TFLN to scale, the industry needs more than performance — it needs manufacturable process design kits and a reliable path from design to pure-play foundry to packaged systems. This partnership brings that together. We are not just advancing the technology; we are setting the foundation for its standardization and large-scale adoption.”
Completing the value chain, izmo Microsystems, headquartered in India, adds advanced semiconductor and photonic packaging capabilities, including heterogeneous integration, co‑packaged optics, and comprehensive system‑level testing. These capabilities are critical for transforming photonic chips into robust, production‑ready subsystems that can be deployed in real‑world environments.
As Mr. Dinanath Soni, Director, izmo Microsystems Private Limited, explained, packaging now plays a decisive role in the success of integrated photonics platforms.
“Advanced photonic packaging is no longer an afterthought — it is central to unlocking performance, reliability, and scalability,” Soni said. “This collaboration connects Europe’s leadership in photonic design and TFLN manufacturing with India’s growing expertise in high‑precision packaging and system integration.”
Technology and Market Context
Integrated photonics has emerged as a foundational technology for AI‑driven data centers, high‑performance computing, advanced communication networks, and emerging applications such as quantum technologies and precision sensing. Increasing data rates at 400G, 800G, and beyond are accelerating adoption of highly integrated optical solutions as electrical interconnects approach their physical limits.
TFLN‑based photonics, in particular, is gaining strong momentum due to its high modulation bandwidth, low drive voltage, and wide operational wavelength range, making it well suited for next‑generation optical interconnects and specialized photonic systems across both commercial and industrial markets.
Scope of Collaboration
Under the MoU, the three companies will collaborate on:
- Aligning Alcyon Photonics’ integrated photonics IP libraries with CCRAFT’s TFLN fabrication processes
- Joint design and production of advanced integrated and TFLN‑based photonic subsystems
- Photonic packaging co‑development, with izmo Microsystems providing design‑for‑packaging guidelines and system‑level integration expertise
- Commercialization of jointly developed solutions for global customers
The partnership establishes a long‑term India–Europe technology bridge, combining Europe’s strengths in integrated photonics design and TFLN manufacturing with India’s expanding photonic and semiconductor packaging ecosystem.
