2018 OIDA Workshop on Scalable Integrated Photonics for 5G and IoT
Events
An OIDA Workshop in Partnership with CIAN, Sponsored by PIXAPP, Go!Foton & AIM
11 March 2018
San Diego Convention Center, Room 20A
San Diego, CA, USA
Fifth generation (5G) wireless and the Internet of Things (IoT) are introducing a wide range of new applications that will depend on performance enhancements across multiple dimensions, including low latency, high capacity, and enhanced resilience. Densification of network access points and capacity will be essential to achieving these performance advances and increased functionality. Standards groups are calling for bandwidth densities as high as 10 Tb/s/km2. High speed access points fulfilling this bandwidth density will be challenged by footprint, power, and cost limitations on facilities that include street lights, kiosks, and traffic lights.
Photonic devices provide capacity and latency that can meet the demanding requirements of 5G and IoT applications. Developing integrated photonic devices that can scale to high volume manufacturing while meeting the tight power and cost constraints promise to open up these rapidly growing markets to photonic devices.
This workshop will examine this opportunity for integrated photonics through plenary and invited talks by leading experts in the field covering the following topics:
- The 5G and IoT markets as they related to integrated photonic devices—where are the largest opportunities and where is the low hanging fruit for photonics to have impact? Overview of the high level business and technical metrics that integrated photonics needs to meet for these applications.
- Major themes and approaches used in 5G and IoT that are relevant to photonic systems. Learn about cloud radio access networks, CPRI, radio over fiber, NFV and SDN.
- In depth analysis of the major technical challenges related to scalable manufacturing, low power, and low cost of integrated photonics in emerging 5G and IoT applications. Including presentations of the state-of- the-art technologies.
- Reports from large international R&D programs on integrated photonics and their strategies for 5G and IoT.
The workshop is targeted at companies and innovators considering or already investing in integrated photonics to meet their future product requirements, and who need to understand key manufacturing challenges and how they can be addressed.
Organizing Committee
Tom Hausken, OIDA, Chair
Peter O'Brien, Tyndall, Ireland, Chair
Dan Kilper, CIAN, USA
Shaya Fainman, University of California, San Diego, USA
Ewit Roos, PhotonDelta, The Netherlands
Marco Ruffini, IPIC/TCD, Ireland
Frank Tolic, Suny Poly, USA
OIDA Workshop Agenda
11 March 2018| 7:30 - 8:15 | Registration and Breakfast |
| 8:15 - 8:30 | Welcome Remarks
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| 8:30 - 10:00 |
Session 1: Keynote Presentations Moderator: Dan Kilper, CIAN
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| 10:00 - 10:30 | Coffee Break |
| 10:30 - 12:00 |
Session 2: Applications and Challenges Moderator: Marco Ruffini, IPIC/TCD
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| 12:00 - 13:30 | Lunch Break and Poster Session |
| 13:30 - 15:00 |
Session 3: Manufacturing Challenges Moderator: Ewit Roos, PhotonDelta
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| 15:00 - 15:30 | Coffee Break |
| 15:30 - 17:00 |
Session 4: Lessons Learned from the Electronics Industry Moderator: Peter O'Brien, Tyndall
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| 17:00 - 17:30 | Session 5: Workshop Wrap-up Moderators: Tom Hausken, OIDA, Dan Kilper, CIAN & Peter O'Brien, Tyndall |
| 17:30 - 19:00 | Networking Reception |
Workshop Sessions
Moderator: Dan Kilper, CIAN
Keynote speakers will describe the requirements of an application area that might employ integrated photonics, such as in5G, IoT, and automotive. The emphasis will be on how connectivity fits into their business models, their outlooks on where their businesses are going, and potential challenges they may face to get to their goals.
PRESENTATIONS INCLUDE:
Seamless Waveform Transport Technologies for Future Mobile and Sensor Networks
Atsushi Kanno, National Institute of Information and Communications Technology
Waveform transport technology for future 5G and beyond mobile communication systems is discussed, particularly focusing on radio over fiber technologies. Use cases based on the radio over fiber systems are reviewed and discussed for application to high-speed train communication networks and sensor over fiber systems.
5G Network Challenges and their Impact Upon Optical Architecture and Integrated Photonic Devices
Theodore (Tod) Sizer, Nokia Bell Labs
Expectations of the impact that 5G will have on our society are high based upon proposed new and exciting applications and experiences, unavailable using today’s LTE technology. While many of these new uses are directly for humans, most are for machines which assist us humans, and thus have markedly different expectations from the networks that serve them. Four network expectations are already clear: Processing will move to the distributed cloud to the greatest extent possible to support dynamic processing; Dynamic and Deterministic networks are required with guarantees on speed, latency, reliability, and security; Higher data rates, driven by new Massive MIMO and mmWave radio systems will necessitate use of fiber to transport information from the antenna to the cloud; and networks will evolve to “short” wireless and “long” fiber as radio range decreases causing the need for an expansion in the number of access points connected over fiber. These expectations, and others, will drive the requirements of the optical networks and devices supporting this network expansion. In my talk, I’ll address these issues, and offer some thoughts on directions and solutions the industry might take to meet the high expectations that 5G brings.
Session 2: Applications and Challenges
Moderator: Marco Ruffini,IPIC/TCD
This session will explore deeper into the applications, discussing the needs, technology, and manufacturing around the applications.
PRESENTATIONS INCLUDE:
Challenges in PIC Packaging
Pim Kat, Technobis IPPS
Packaging of PIC’s appears far more critical for the chips than packaging of electronic chips. Internal stresses, temperature fluctuations, temperature gradient on the chip, all contribute to changes in functionality of the chip after packaging. This presentation depicts on critical aspects of PIC packaging and how these are addressed properly in order to achieve mature assembly capability and production of PIC packages.
5G as a Catalyst for Optical-Wireless Convergence in the Access
Claudio Mazzali, Corning
We will discuss how 4G/5G densification can act as a catalyst for true converged optical-wireless access networks. The expected optical infrastructure necessary and how different choices of architectures and topologies can impact the requirements and demand for outside plant ready optical links and integrated photonic components. This expected fiber-rich platform enabling the convergence of 5G fronthaul with other access networks will open new opportunities for cost effective IoT, smart cities, edge computing and other upcoming services and applications.
5G PPP blueSPACE project: Building on the Use of Spatial Multiplexing 5G Networks Infrastructures and Showcasing Advanced Technologies and Networking Capabilities
Idelfonso Tafur Monroy, Eindhoven University of Technology (TU/e) and Photonic Integration Technology Center (PITC)
This is a presention of the concept of the European 5G PPP project BLUESPACE whose core is to exploit the added value of Spatial Division Multiplexing (SDM) in the Radio Access Network (RAN) with efficient optical beamforming interface for the pragmatic Ka-band wireless transmission band. Both being seamlessly integreable in next generation optical access networks infrastructures with massive beam steering capabilities and with flexible network management control. We discuss as well the role of photonics in BLUESPACE and related 5G PPP projects fort the realization of a truly viable and efficient path for 5G wireless communications with a 1000-fold increase in capacity, connectivity for over 1 billion users, strict latency control, and network software programming.
Optical Networking Technologies in Support of 5G
Anna Tzanakaki, Bristol University
This presentation focuses on the provisioning of a variety of 5G services over converged network and compute infrastructures. Currently these services are supported through distinct and separate application-specific platforms having significant installation, operational and administrative costs. To overcome these inefficiencies we propose the adoption of flexible and elastic optical networking to support transport network requirements combined with novel concepts such as disaggregation of hardware (HW) and software (SW) components. “Resource disaggregation” enables the creation of a “pool of resources” that can be individually selected and allocated on demand to compose any infrastructure service. The performance of the proposed solution is evaluated through modeling results. Some insight of the 5G UK Trials work currently ongoing at Bristol, UK, deploying some of these architectural principles, will be also discussed.
Low-cost and Flexible Tunable Transmitters for Future-Proof Access Networks
Joost Verberk, EFFECT Photonics
Future access networks will have to serve a broad variety of applications that all have different requirements. This means that the components in the network need to be flexible in their operation, while maintaining a low cost structure. In this presentation we will be looking at how photonic integration technology can provide low cost tunable lasers that have core network performance at access network price points.
Session 3: Manufacturing Challenges
Moderator: Ewit Roos, PhotonDelta
Speakers will provide perspectives and share experiences related to different size organizations and the overall eco-system for bringing integrated photonics based products to market. Issues unique to both small and large companies will be considered.
PRESENTATIONS INCLUDE:
Leveraging Semiconductor Technologies for the Manufacturing of Advanced Optical Interconnect Solutions
Peter De Dobbelaere, Luxtera
Silicon Photonics is in volume production by multiple suppliers. Most of the applications are in the area of intra datacenter interconnect. In our presentation we will briefly discuss how we use the semiconductor ecosystem for high volume manufacturing of high performance, low cost optical transceivers. We will also highlight future advanced integration of photonic transceiver functionality with ASICs leveraging 2.5D integration technologies.
GLOBALFOUNDRIES 300mm Silicon Photonics Foundry
Ken Giewont, GLOBALFOUNDRIES
Silicon Photonics applications are rapidly expanding into several market segments which will continue to drive demand for rapid product development hardware turn-around with a seamless path to product qualification and volume manufacturing. GLOABALFOUNDRIES will present an overview of their 300mm Silicon Photonics Foundry offering which includes a broad photonic device library with monolithic CMOS, passive fiber attach and custom design options. A state-of-the-art Cadence PDK is offered which enables co-design of electrical and optical components with a full suite of standard design tools. Optical test capability for use in manufacturing controls, technology development, modeling and product wafer level testing will be described. Unique manufacturing challenges associated with Silicon Photonics will be presented. The technology qualification, MPW availability and development roadmaps will be shared.
Daniel Mahgerefteh, Finisar Corporation
The Challenge of Manufacturing PICs on InP
Richard Visser, SMART Photonics B.V.
From making 16 discrete lasers on 1mm² to a PIC of 16mm². From manufacturing a few hundred 2” InP wafers per year to thousands of 4” wafers per month. Manufacturing PIC’s requirements requires InP Fabs to improve performance and to change to a larger wafer size. The real challenge however is the lack of standards and how to manage the diversity of processes.
Session 4: Lessons Learned from the Electronics Industry
Moderator: Peter O'Brien,Tyndall
Integrated photonics promises to make photonics more like electronics. The wafer cost of electronics usually dominates the manufacturing cost, while the packaging and assembly cost dominates in photonics. The industry aims to change that balance with integrated photonics, but many challenges remain. This session will focus on the manufacturing of integrated photonics by drawing from lessons learned from the manufacture of silicon electronics and circuit boards.
PRESENTATIONS INCLUDE:
Next Wave of RF & Photonics Packaging Solution
Vincent Lin, ASE Group
When Moore’s law goes slow, driving force of connectivity and cloud services are still very strong. Data growth requirement exceed the improvement speed of any kind of individual chip technology (ex: CMOS), therefore, heterogeneous integration is the solution of de-bottleneck of bandwidth. OSAT now is not only driven by the requirement of digital CMOS, but also provide solutions of emerging technologies of RF and Photonics. RF module of mobile device and Si-Photonic module of data center are the key components of two ends of cloud services platform, both of them need high speed interconnection amount chips with different materials, includes compound semiconductor, silicon and passives or special crystal. Impendence matching and lower insertion loss are the key performance index. In this presentation, we will reveal new package platforms of both RF-module and Si-Photonics module; innovated solutions are proposed to enable further miniaturization while keeping high performance and functional integration.
Sensors and Actuator Semiconductors to Enable Autonomous Driving
Hans Stork, Senior Vice President & CTO, ON Semiconductor
The rapid progress of increasing levels of autonomous driving is made possible through the advanced capabilities of semiconductors that handle computation, communication, sensory input and actuator control.
Starting with an overview of the various semiconductor applications and the associated device features in automobiles, we will highlight the progress in image sensors and processors to enable camera and Lidar functions for autonomous vehicles. In particular, we will show examples of how automotive requirements are challenging to meet due to large dynamic range of environmental conditions as well as stringent safety and quality expectations.
Packaging Developments from MEMS and Sensors to Application Processors: Lessons Learned in Co-Design and The Economics of Packaging in Smartphones
Jan Vardaman, TechSearch International
The packaging and assembly industry has undergone many changes with the growth of the smartphone. The introduction of an increased number of MEMS and sensors in a platform with high volume provided the opportunity to gain economics of scale for many MEMS and sensor package. The move from custom packages to standard package formats enabled cost-effective packaging solutions that scale with increased volumes. Products on the market today use many different packages including stacked packages (3D), BGAs, CSPs, WLPs, and leadframe packages such as QFNs are discussed. Also discussed is the role of silicon and package co-design in meeting the requirements for application processors. The success of Apple and TSMC in developing the fan-out wafer level package for application processors is discussed. This presentation examines trends in adoption of packages for MEMS and sensors to lower total cost and discusses the growing trend in co-design for new application processor packages. The role of co-design is examined and lessons that can be applied to optoelectronics packaging are discussed.
Session 5: Workshop Wrap-up
Moderators: Tom Hausken, OIDA, Dan Kilper, CIAN & Peter O'Brien, Tyndall
This session begins with comments from pre-selected speakers who try to summarize the findings of the day in a few words or sentences. Then the audience is invited to offer the same or discuss them. This is intended as a way to leave the attendees with more than just presentations, but also some conclusions about ramping to volume manufacturing.
Speakers
Peter De Dobbelaere, Vice President, Engineering, Luxtera, USA
From 1991 to 1995, Peter was employed by IMEC, Belgium working on various projects including short reach optical interconnect and heterogeneous integration of III-V lasers with Si and polymer waveguides. From 1995 to 1999, he was with Akzo-Nobel N.V., The Netherlands and U.S., where he was engaged in product development and reliability of polymer-based thermo-optic waveguide switch devices. In 1999, he joined OMM Inc., San Diego, CA, where he was responsible for product and technology development of MEMS-based optical switches. His latest position there was CTO and Director of Product Engineering and Reliability. In 2004, he joined Luxtera, Inc., in Carlsbad, CA, where he is currently responsible for technology development for silicon photonics.
Ken Giewont, Technology Development Fellow, GLOBALFOUNDRIES, USA
Ken Giewont is currently a Fellow at GLOBALFOUNDRIES, working on Silicon Photonics Technology Development and New Products Introduction since 2015 where his focus has been to establish a competitive 300mm silicon photonics foundry platform. Prior to this assignment, Ken worked for IBM developing and manufacturing high performance CMOS technology for hi end server and ASIC applications from 130nm to 22nm nodes. Having the opportunity to help bring silicon photonics into the foundry main stream has been an exciting and challenging assignment. Ken has an Engineering Science BS from Penn State University and an Electrical Engineering MS from Syracuse University.
Atsushi Kanno, Senior Researcher, National Institute of Information and Communications Technology, Japan
Dr. Atsushi Kanno received B.Sci., M.Sci., and Ph.D. degree in science from the University of Tsukuba, Japan, in 1999, 2001, and 2005, respectively. In 2005, he was with the Venture Business Laboratory of the Institute of Science and Engineering, University of Tsukuba. In 2006, he joined the National Institute of Information and Communications Technology (NICT), Japan. His research interests are microwave/millimeter-wave/terahertz photonics, ultrafast optical and radio communication systems, lithium niobate optical modulators, and ultrafast phenomena in semiconductor optical devices. He is a member of the Institute of Electronics, Information and Communication Engineers (IEICE), the Japan Society of Applied Physics (JSAP), the Laser Society of Japan, and the Institute of Electrical and Electronic Engineers (IEEE).
Pim Kat, CEO Technobis Group, Technobis IPPS, The Netherlands
Pim Kat has a background in mechanical engineering. He worked as researcher at Hoogovens in the field of computer controlled motion (what is now mechatronics). He started his own company Technobis in 1996. Technobis is worldwide front runner in developing and providing solutions for fiber optic sensing systems based on integrated photonics. Currently Technobis is the only company that successfully commercialized an Integrated Photonics based FBG interrogator system platform, called Gator®. Besides being the CEO of the Group, Pim is involved in most of the R&D work for integrated photonics.
Vincent Lin, Technical Director Corporate R&D/Technology Development, ASE GROUP, Taiwan
Vincent Lin has his Ph.D. in Power Mechanical Engineering from the National Tsing Hua University, Taiwan. He is the Technical Director, ASE GROUP/ New packaging technology development of wireless and optical interconnection. His past experience includes being a Senior Manager at Qualcomm/ MEMS&TFT integrated display development and Dept. Manager at Touch Micro System Technology / Micromachining process development, MEMS simulation, characterization and technical marketing.
Daniel Mahgerefteh, Director of Technology, Datacom Engineering, Finisar Corporation, USA
Daniel Mahgerefteh is the Director of Technology, Datacom Engineering, at Finisar Corporation and leads the Integrated Photonics Group, which is focused on Si photonics and low cost packaging for Datacom and telecommunications markets. Previously Daniel was the co-founder and Chief Technology Officer of Azna LLC and the co-inventor of the Chirp Managed Laser (CML) technology. Daniel has over 60 issued or pending patents and is the author of numerous publications.
Claudio Mazzali, Sr. Vice President, Technology Corning Optical Communications, Corning, USA
Dr. Claudio Mazzali was appointed Senior Vice President, Technology, Corning Optical Communications and Optical Connectivity Solutions in January 2015. In this role, Mazzali expanded his previous responsibility, acting now as the chief technology officer for the COC sector while still responsible for the technology development for the OCS division.
Previously, Mazzali was the business technology director for the Telecom Sector, leading its early stage development by leveraging a close connection with the Research organization and focusing on integrated solutions that require collaboration between fiber, cables, and connectivity.
Mazzali joined Corning in 1999 at the Brazilian regional office as an optical communications specialist, and later became technical manager for Corning Optical Fiber in Latin America. In 2001, Mazzali was transferred to Corning, New York, and has held multiple positions in Corning Optical Fiber, including strategic alliances manager, product line manager for high-data-rate and submarine products, and new business development manager. Mazzali holds a Ph.D. in physics from the Gleb Wataghin Physics Institute at Unicamp, Brazil.
He is a member of The Optical Society, and the current Chair of the OIDA (OSA Industry Development Associates) Council.
Idelfonso Tafur Monroy, Professor, Director Photonic Integrated Systems at PITC, Eindhoven University of Technology (TU/e) and Photonic Integration Technology Center (PITC), The Netherlands
Idelfonso Tafur Monroy graduated from the Bonch-Bruevitch Institute of Communications, St. Petersburg, Russia, in 1992, where he received the M.Sc. degree in multichannel telecommunications. In 1996, he received a Technology Licentiate in telecommunications theory from the Royal Institute of Technology, Stockholm, Sweden. In same year, he joined the Electrical Engineering Department, Eindhoven University of Technology, Eindhoven, the Netherlands, where he received the Ph.D. degree in 1999 and worked as an Assistant Professor until 2006. He founded and led until 2017 the Metro-Access and Short Range Communications Group of the Department of Photonics Engineering, Technical University of Denmark. He has been a visiting professor/scientist at BUPT Beijing China, UC Berkeley, and ITMO University, Russia.
He has participated in several European research framework projects in photonic technologies and their applications to communication systems and networks. His research interests include photonic and electronic THz technologies, high-capacity hybrid optical fiber-wireless communications, digital signal processing for optical transceivers,, and the application of integrated photonic technologies for telecom, data center and sensing systems.
Prof. Tafur Monroy currently coordinates the 5G PPP blueSPACE and H2020 ITN CELTA projects. He is co-author of over 500 journal and conference papers, has graduated 20 PhD students, and is a co-founder of the start-up Bifrost Communications developing NG-PON2 optical transponder solutions.
Theodore (Tod) Sizer, VP, IP and Optical Network Research, Nokia, USA
Dr. Theodore (Tod) Sizer is Head of IP and Optical Network Research in Nokia Bell Labs. In this role, he leads teams innovating in all aspects of IP and Optical solutions for core, metro, submarine, and data center communications. Prior to his current role, Tod lead Wireless Research in Nokia Bell Labs for nine years creating the vision and research of 5G and the new technologies that will be required to meet the needs of an Always Connected world with expectations of Infinite Capacity. Tod graduated from Amherst College, Magna Cum Laude in Physics and Astronomy and received his Masters and Doctorate in Optics from the Institute of Optics at the University of Rochester. In 2007 Tod was named a Bell Labs Fellow “For sustained creative contributions to wireless systems, particularly in the convergence of packet and wireless technologies” and in 2012 was named a WWRF Fellow. In 2012 he received the Popular Science Breakthrough Innovation award for the lightRadio invention. He serves as a member of the VCAT (Visiting Committee on Advanced Technology) which is the principal industry advisory board towards NIST (National Institute of Standards and Technology), part of the US Department of Commerce. He was named an IEEE Fellow in 2015 for “Leadership in Wireless Communications Technology”. He is the author of 52 US patents, over 50 refereed publications and is a member of the IEEE and OSA.
Hans Stork, Sr. Vice President & CTO, ON Semiconductor, USA
Dr. Hans Stork is Senior Vice President and Chief Technology Officer (CTO) at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, design libraries, as well as packaging technologies and assembly support.
Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and CTO of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the CTO of Texas Instruments. Before that, Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.
Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC, and has previously served on the boards of Sematech and the SRC. He is also a longstanding member of the SIA Technology Strategy Committee.
He authored more than 100 cited papers and holds 11 U.S. patents. He was elected IEEE Fellow in 1994, and served on several IEEE sponsored conference program committees, and is currently vice-chair of the Technical Field Awards Council and a member of the Awards Policy and Portfolio Review Committee.
Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering (EE) from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.
Anna Tzanakaki, Research Fellow, University of Bristol, UK
Anna Tzanakaki is a Senior Research Fellow at the University of Bristol, UK and holds an academic post at the National and Kapodistrian University of Athens, Greece. Previously she was an Associate Professor at the Athens Information Technology, Greece where she was leading the Network Design and Services research group and was an adjunct faculty member of the Information Networking Institute of Carnegie Mellon University, USA. She has obtained a BSc degree from the University of Crete, Greece, an MSc and a PhD both from the University of Essex, UK. She was a co-founder and a senior engineer of ilotron ltd, a high-technology spin-off from the University of Essex and a principal engineer of Altamar Networks, USA. She is a co-author of over 160 publications in international journals and conferences. She is a co-inventor of several granted and published patents. She is a member of several Technical Program Committees of international scientific conferences and is serving as associate editor of the IEEE/OSA Journal of Optical Communications and Networks. She is the Technical Coordinator of the H2020 5G-PPP EU project 5G-PICTURE and was the technical coordinator of the FP7 EU project CONTENT and has actively participated in numerous EU and national research collaborative projects. Her research interests include network architectures, technologies and protocols in support of 5G networks and beyond.
Jan Vardaman, President & Founder, TechSearch International, USA
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT (now EPS) and is an IEEE CPMT (EPS) Distinguished Lecturer. She is a member of SEMI, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Joost Verberk, Director of PLM, EFFECT Photonics, The Netherlands
Joost Verberk has a Masters Degree in Electrical Engineering, Control Systems from the Eindhoven University of Technology. After graduation, Joost stayed at the university for an additional year to continue his graduation research as part of the European research project E-Price, which investigated a reliable, an efficient and a societal-acceptable control concept for the EU energy market. Joost continued working in the energy sector and joined GDF SUEZ (currently Engie), which is one of the largest global energy producers. Engie had already realised that future energy consumption would be closely tied to datacenter / telecoms energy consumption and he joined their Smart Digital Solutions business unit, where he started out a business consultant and was eventually program manager for several Software-as-a-Service solutions. Joost joined EFFECT Photonics two and a half years ago as Director of PLM, where he is now responsible for the high-speed direct-detect portfolio of products. In his current role, he works closely with the customers to understand their current and future needs, and the engineering teams to provide fit-for-purpose solutions.
Richard Visser, CEO, SMART Photonics B.V., The Netherlands
Richard has a background in electronics and worked for companies like ASML and Philips. In 2012 Richard founded SMART Photonics, a Pure Play InP Foundry. Over the past 6 years this company has evolved into a trusted manufacturer of both discrete as well as complex InP based PICS. As CEO, Richard is overall responsible for a fast-growing enterprise.
