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2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March, 2021
In-person Event - Eastern Time (US & Canada) (UTC -05:00)


Vivek Raghunathan

Broadcom

About the Speaker
Vivek Raghunathan is a Sr. Principal Engineer and Program Leader for Integrated Silicon Photonics at Broadcom driving key core technology development that spans every component required to co-package optics with switches. Prior to joining Broadcom, he was a Principal Engineer at Rockley Photonics where he led silicon photonics product integration for their data-com product line. He started his career at Intel where he led next generation semiconductor packaging technology development for Intel’s 14nm and 10nm technology nodes. He then joined their Silicon photonics division where he led the ramp and commercialization of their first Silicon photonics based transceivers. He received his doctorate in Silicon Photonics from MIT and has over 14 years of experience in this field. He received his Bachelor of Technology degree in Materials Science & Engineering from Indian Institute of Technology. He has around 13 patents and 10 journal publications & conference presentation.
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