Events
2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers
30 - 31 Mar 2021
Eastern Time (US & Canada) (UTC - 05:00)
2021 OIDA Workshop
Data centers will increasingly rely on embedded photonics for enhanced connectivity between servers, memory, and computational systems. Furthermore, the integration of photonic functionality onto a single chip and co-packaged with electronics is a path to increase bandwidth and operational efficiencies even more, addressing many of the emerging challenges on data center roadmaps. However, even though embedded photonic technologies have been shown to meet much lower link and switch budgets when compared to conventional electronic technologies, their widespread deployment is still impeded by significant technical, manufacturing and cost barriers.
This workshop will review emerging trends for data centers and critical challenges embedded photonics must overcome to be considered a viable mass market technology. The workshop will include invited talks from leading decision makers with responsibility for the development of next generation data centers, presenting their key technology and cost requirements. The workshop will also have invited speakers from leading photonic companies and service providers who are developing innovative products and advanced manufacturing services to meet these emerging requirements. The workshop will provide an opportunity for attendees to contribute to the discussion through interactive panel sessions.
This OIDA workshop will be the 10th in a series on topics important to the commercialization of new optical communications components and equipment, particularly for the manufacture of integrated photonics as the next platform for optical communications.
Who Should Attend?
- Business Development Directors
- Component Manufacturers
- Optical Systems Developers and Managers
- Assembly and Test Equipment Vendors
- Semiconductor Manufacturers
- Venture Investors
- Market Analysts
Join Colleagues from these Innovative Companies:
- Broadcom
- Cadence
- Cisco
- Elenion Technologies
- Global Foundries
- IBM
- Infinera
- Intel
- INVIDIA
- Luxtera
- Microsoft
- NVIDIA
- Optoscribe
- Precision Optical Transceivers
- SCINTIL Photonics
- Tencent
About Our Speakers
Philippe Absil
Vice President R&D, Head of the 3D and Silicon Photonics Technologies Department, IMEC
Hitesh Ballani
Intel
Alexis Black Björlin
Senior Vice President and General Manager of the Optical Systems Division, Broadcom
Robert Blum
Director, Strategic Marketing & Business Development , Intel Corporation
Darius Bunandar
Founder and Chief Scientist, Lightmatter
David Chen
AVP of Transceiver Technology & Strategic Marketing, Applied Optoelectronics, Inc. (AOI)
Larry Dennison
Director of Network Research, NVIDIA
Ken Giewont
Fellow - Technology Development, GLOBALFOUNDRIES
Madeleine Glick
Senior Research Scientist, Columbia University
Richard Grzybowski
General Manager of Silicon Photonics, Lightwave Business Unit, MACOM
Tom Hausken
Senior Industry Advisor, The Optical Society
Gordon Keeler
Program Manager in the Microsystems Technology Office (MTO), Defense Advanced Research Projects Agency,DARPA
Daniel Kilper
Research Professor, Optical Sciences, CIAN, University of Arizona
Twan Korthorst
Director, Synopsys Photonic Solutions, Phoenix/Synopsys
Thomas Liljeberg
General Manager, Photonic Integration; Silicon Photonics Products Division, Intel
Sun Min
Optical Architect, Tencent
Peter O'Brien
Director, European Photonics Packaging Pilot Line (PIXAPP) & Head of Photonics Packaging Group, Tyndall Institute
Sven Otte
CEO, Sicoya
Sandeep Razdan
Senior Principal Engineer in the Optical Systems Division (OSD), Broadcom
Ted Schmidt
Distinguished Engineer, Silicon Photonics, Juniper
Greg Young
Cisco
Mark Filer
Microsoft
Mark Wang
Tencent
Sylvie Menezo
SCINTIL Photonics
Anu Agarwal
Massachusetts Institute of Technology
Gilles Lamant
Cadence
Vikas Gupta
GlobalFoundries
Michael Haney
ARPA-E
Rob Stone
Yi Qian
MRSI Systems & Mycronic
Nick Harris
Lightmatter
Vivek Raghunathan
Broadcom
