Skip To Content

2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March, 2021
In-person Event - Eastern Time (US & Canada) (UTC -05:00)


Gilles Lamant

Cadence

About the Speaker
Gilles S.C. Lamant holds an engineering degree (~MsEE) from ESIEE (Ecole Superieure d’ingénieurs en Electronique et Electrotechnique), Paris, France. After holding several customer facing positions in Cadence Services organization, with a focus on custom (analog) design, in multiple countries (US, Japan, Russia), he joined the Virtuoso Custom Platform R&D team in 2003. His interests are usually found below Metal1, at the device level (FEOL). He pioneered the Virtuoso FinFET implementation, and has been focussing on the photonics layers for the past few years. In that capacity, he has led the partnership between Cadence and other eco-system companies driving the integration and co-development of the EPDA (Electronics-Photonics Design Automation) platform around the Virtuoso® Platform as well as organic development related to photonics, such as the CurvyCoreTM technology or the modeling of complex structured signals in Spectre® . His current focus is on the system co-integration of photonics elements with electronics. He is a Cadence Distinguished Engineer, a Senior Member of IEEE, and holds over 15 granted patents.
Image for keeping the session alive