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All scheduled events, except Reception and Welcome Dinner, are at the Warwick Hotel

Rue Duquesnoy 5, 1000 Bruxelles, Belgium

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Affiliations & Program Notes

With the industry moving toward co-packaged optics and tightly integrated photonic–electronic systems, manufacturing requirements are shifting from discrete assembly toward advanced wafer-level packaging. This includes processes such as 2.5D/3D integration, wafer-level photonic assembly, redistribution layers, ultra-fine-pitch interconnects, wafer-level optics, and hybrid bonding.
This session brings together experts working on these key process modules. Presentations will address how wafer-level approaches improve alignment precision, thermal management, electrical/optical interconnect density, and overall manufacturability. The goal is to examine how wafer-level integration can reduce cost, increase throughput, and support the high-volume requirements of emerging compute, datacom, and sensing systems.

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The integration of photonics within semiconductor manufacturing has become a cornerstone of innovation in data communications, sensing, and high-performance computing. As the boundaries between optical and electronic components continue to blur, semiconductor fabs are adapting to new materials, processes, and equipment capable of supporting photonic integration at wafer scale.
This session explores the technological and manufacturing advances that make photonic device production compatible with existing semiconductor process environments, complemented by success stories that demonstrate how these developments are enabling scalable, reliable, and cost-effective industrial production.

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Quantum and optical computing are emerging as transformative technologies, demanding unprecedented precision and integration in manufacturing. This session explores how advancements in semiconductor processes and photonic packaging are paving the way toward scalable computing.

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Automation and artificial intelligence are redefining how photonics products are designed, operated, and scaled. As devices become more complex and integration densities increase, intelligent process control and digitalization are essential to maintain precision, quality, and cost efficiency. This discussion will cover the latest progress in robotics, digital twins, and AI-driven manufacturing solutions that enable higher yield, faster development cycles, and adaptive production environments.

Time

Events & Presenters

Affiliations & Program Notes

All scheduled events, except Reception and Welcome Dinner, are at the Warwick Hotel

Rue Duquesnoy 5, 1000 Bruxelles, Belgium

Time

Events & Presenters

Affiliations & Program Notes

The integration of photonics within semiconductor manufacturing has become a cornerstone of innovation in data communications, sensing, and high-performance computing. As the boundaries between optical and electronic components continue to blur, semiconductor fabs are adapting to new materials, processes, and equipment capable of supporting photonic integration at wafer scale. This session explores the technological and manufacturing advances that make photonic device production compatible with existing semiconductor process environments, complemented by success stories that demonstrate how these developments are enabling scalable, reliable, and cost-effective industrial production.

Time

Events & Presenters

Affiliations & Program Notes

The convergence of advanced manufacturing and photonic technologies is enabling a new class of optical sensors, integrated devices, and on-chip solutions used across health, environmental monitoring, industrial automation, and beyond. This session highlights how precision manufacturing, photonic integration, and semiconductor-inspired processes are accelerating the development and production of these emerging applications, opening pathways to scalable, high-performance systems in a wide range of fields.

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Events & Presenters

Affiliations & Program Notes