LAC Panels
Laser Applications Conference Panels
Brittle Materials Processing
Organizer: Stuart McLean, Coherent Corp., USA
Brittle materials pose a significant challenge to mechanical machining. Lasers have a unique advantage in processing a variety of brittle materials as their wavelengths and pulse durations can be tailored to optimize the material interaction. Brittle materials such as Glass, Sapphire, Silicon, SiC and Diamond are increasingly benefitting from laser processing. Unique laser cutting, drilling, selective etching and polishing methods are lowering the cost of machining these materials at unprecedented accuracy. Lasers are finding increased adoption in this application as the available pulse energy and speed of processing scales to be more cost effective.
Invited Speakers:
Astrid Sassmannshausen, Fraunhofer Inst for Laser Technology ILT, Germany
Mareike Shaefer, Inst für Oberflächen-und Schichtanalytik, Germany
EUV, X-Ray Generation & Particle Acceleration
Organizer: Lahsen Assoufid, Argonne National Laboratory, USA
The rapid progress in extreme-power laser technology opened a path to the development of a new generation of small-scale EUV, X-ray and Gamma-ray light sources with unprecedented brightness and short pulses. These sources, which could fit on a tabletop or in a small-scale laboratory, will revolutionize many industrial, research, medical, defense and security applications. This session focuses on the latest developments, needs and challenges in high-power laser technologies tailored to methods for short (EUV, X- and Gamma-ray) wavelength generation and particle acceleration.
Fusion Energy
Organizer: Vincent Issier, MKS Insturments Inc., USA
Nuclear fusion promises an abundant, inexhaustible source of clean energy without the greenhouse gas emissions of fossil fuels or the radioactive waste of nuclear fission. The last few years have seen enormous progress towards functional fusion using lasers for inertial confinement. Scientists at the National Ignition Facility at the Lawrence Livermore National Laboratory in California (LLNL) managed to produce, in December 2022, for the first time, a nuclear fusion reaction that released more energy than it used. This critical milestone paves the way for the future of clean energy generation. Meanwhile, funding is accelerating, and several private companies have raised well over $ 100 million. This panel aims to provide an overview of the Laser Fusion.
Global Security and Directed Energy
Organizer: Sandra Biedron, Element Aero and the Center for Bright Beams, USA
High-energy and high-intensity continue to mature and have myriad applications related to security and defense. This session will provide an overview of applications, such as directed energy, remote sensing, securing the microelectronics supply chain, wavelength accessibility, and aspects of unique user-accessible facilities for collaborative research and development. The session will also explore aspects of the workforce as well as supply chain for this unique sector of lasers and peripherals for global security.
Laser-Based Additive Manufacturing
Organizer: Houbertz Ruth, ThinkMade Engineering & Consulting, Germany
Description will be available soon.
Laser-Beam Delivery and Beam Manipulation of High-Power Laser Beams
Organizer: Bryan Germann, AEROTECH, USA
The trend of ever-increasing power levels and shorter pulse durations for industrial laser systems and applications presents challenges and exciting opportunities for the field of beam delivery and manipulation. As peak power increases and wavelengths decrease, traditional optical components face limitations in handling the thermal loads and nonlinear effects that can degrade beam quality and lead to component damage. This session will explore the issues and current technology available to address these concerns as they directly apply to application requirements for microprocessing with lasers. A mixture of academic and industry experts will discuss innovative materials, adaptive optics, novel beam shaping, and control techniques emerging to overcome these hurdles and ensure precise and efficient light delivery to the target in demanding applications.
Micro-Nano Machining
Organizer: Houbertz Ruth, ThinkMade Engineering & Consulting, Germany
Description will be available soon.
ML/AI for Laser Materials Processing
Organizer: Thomas Grünberger, Plasmo Industrietechnik GmbH, Austria
The session will provide an overview of the possibilities of AI and ML including examples in the field of laser material processing. Attention will be drawn on added value in the field of data analytics in all forms - descriptive, diagnostic, predictive and prescriptive analytics. Machine Learning/Artificial Intelligence are data driven approaches, so topics from data synthesis (acquisition), data preparation, model development and verification will be addressed.
Invited Speakers:
Simon Altenburg, BAM, Germany
Andrés Lasagni, Fraunhofer IWS, Germany
Surface Modification & Micromachining
Organizer: Heather George, TRUMPF Inc., USA
Surfaces are integral in mechanical and chemical interactions, and laser surface modification gives a degree of control in those interactions that is not possible with other processing techniques. From applications in hardening, to the texturing of surfaces for improved adhesion, lasers have the precision to tailor surface topology. Multiplexing and interference techniques are being developed to apply laser processes to large area surfaces. This session will focus on the latest capabilities of lasers, scanning techniques and processes to control fine structures for emerging market applications.
THz Generation & Applications
Organizer: Kei Takeya, Institute for Molecular Science, Japan
In recent years, terahertz (THz) wave technology has advanced rapidly, with applications expanding into areas such as non-destructive inspection, medical diagnostics, security, and next-generation wireless communications. Furthermore, the emergence of high-power THz sources with mJ pulse energies has opened up new possibilities for applications. As a result, THz waves are also expected to serve as promising sources for particle acceleration and dielectric acceleration. In this session, we will introduce the latest advancements in THz wave technology and explore the newest developments in its applications.
Invited Speakers:
Yuma Takida, RIKEN, Japan