Optional Welcome Dinner hosted by Optica

Dinner and networking the evening before the meeting. Venue in the Eindhoven area, to be confirmed.

Registration, badging and coffee welcome

Welcome remarks

Jose Pozo, CTO, Optica, and ASML host representative (TBC).

Keynote 1: Host keynote, ASML (speaker TBC)

How optics enables semiconductor manufacturing, and what ASML expects from the photonics ecosystem as optical interconnects enter the package.

Session 1: Optics at the Core of Semiconductor Manufacturing

Semiconductor manufacturing runs on optics: lithography projection optics, optical metrology and inspection, alignment sensors and interferometry. This session examines what chipmaking demands of optical manufacturing in precision, volume and reliability, and what the photonics industry can take from decades of semiconductor equipment engineering as it scales its own production.

Four speakers TBC: lithography and optical systems, metrology and inspection, precision optics manufacturing, wafer-level optics.

Keynote 2 (speaker TBC)

Target profile: hyperscaler or AI-systems company deploying co-packaged optics.

Panel 1: Co-Packaged Optics in Volume. What the First Production Ramps Taught Us

With foundry silicon photonics platforms in volume production and co-packaged optics switches shipping, this panel takes stock of the first real ramps: where yield was lost, what fiber attach and laser integration looked like at volume, how test bottlenecks were handled, and what second-generation platforms will demand from packaging, equipment and materials suppliers.

Moderator plus five to six panelists TBC: foundry, switch or module maker, fiber and connector supplier, laser supplier, OSAT or assembly house.

Keynote 3 (speaker TBC)

Target profile: advanced packaging technology leader, foundry or IDM.

Session 2: Advanced Wafer-Level Packaging and Hybrid Integration

The packaging toolbox is widening: 2.5D and 3D integration, hybrid bonding, redistribution layers, ultra-fine-pitch interconnects, wafer-level optics, and now glass substrates and panel-level processing moving toward photonics. This session covers which of these process modules are ready for photonic-electronic integration, at what cost points, and where equipment and materials gaps remain.

Four speakers TBC: hybrid bonding, glass or panel-level substrates, wafer-level photonic assembly, micro-transfer printing or heterogeneous integration.

Panel 2: Automation, AI and Digital Twins for Photonics Manufacturing

Continuing the discussion opened in Brussels: intelligent process control, robotics, digital twins and AI-driven yield learning as photonic assembly moves from operator-tended cells to lights-out production. The panel asks what actually raised yield and throughput in the last twelve months, and where AI in the fab is still a slide rather than a tool.

Moderator plus five panelists TBC: assembly equipment makers, test and inspection, module maker, software or yield analytics.

Dinner reception

Venue in Eindhoven or Veldhoven, to be confirmed.

Welcome breakfast

Welcome remarks

Jose Pozo, CTO, Optica.

Keynote 4 (speaker TBC)

Target profile: ASML technology leadership or semiconductor equipment strategist.

Session 3: Test, Metrology and Yield. Getting Photonics to Semiconductor Grade

Semiconductor economics are built on known-good die, inline metrology and relentless yield learning. Photonics is not there yet. This session covers wafer-level optical test, inline process metrology for photonic structures, burn-in and reliability screening, and the equipment being built to close the gap between photonic and electronic yield practice.

Four speakers TBC: wafer-level test equipment, optical metrology, foundry yield engineering, module-level reliability.

Keynote 5 (speaker TBC)

Target profile: CEO of a scaling photonics company on the build-versus-partner manufacturing decision.

Session 4: Emerging Applications Enabled by Advanced Manufacturing

Beyond datacom: how semiconductor-grade photonics manufacturing opens volume markets in sensing, quantum systems, health and industrial applications. Three speakers TBC, each pairing an application with the specific manufacturing advance that made it viable.

Lunch

Dinner reception

Venue in Eindhoven or Veldhoven, to be confirmed.