The Global Advanced Manufacturing Alliance (GAMA) Annual Meeting brings together the companies working to make photonics manufacturable at semiconductor scale: photonics and semiconductor manufacturers, advanced packaging and assembly specialists, module developers, foundries, and the equipment, tools, materials and metrology suppliers behind them.

In 2027 the meeting moves to where optics and semiconductor manufacturing meet. ASML hosts GAMA at its Veldhoven headquarters, the company's largest R&D and manufacturing site. Every advanced chip made today is patterned by ASML lithography systems built around some of the most precise optics ever manufactured. No venue makes the case more directly that optics enables semiconductor manufacturing worldwide, and no host offers better access to the people who make that happen. Attendees will interact directly with ASML experts and decision makers on their own campus.

The timing matters. By May 2027, co-packaged optics will have moved from announcements to volume: TSMC's COUPE platform entered volume production in 2026 and NVIDIA's co-packaged optics switches are shipping. The question is no longer whether photonics can be manufactured at scale, but who has the packaging, test, automation and equipment to do it at semiconductor-grade yield and cost. GAMA 2027 puts that question at the center of the program.

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