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OIDA Workshop On Embedded Photonic Manufacturing for Data Centers


After careful consideration, OSA management has decided to cancel the OIDA Workshop for Sunday, 8 March.
OIDA Workshop registrants will receive a full refund. You do not have to take any action.

We look forward to bringing you future programs and events that impact the industry.

OIDA Workshop Agenda*

8 March 2020

7:30 - 17:30 Registration Open
7:30 - 8:15 Breakfast
8:15 - 8:30

Welcome Remarks & Opening Comments

8:30 - 10:00

Session 1:  Data Center Requirements and Technology Roadmap

Moderator: Hitesh Ballani, Microsoft

10:00 - 10:30 Coffee Break
10:30 - 12:00

Session 2:  Embedded Photonic Products for Future Data Centers

Moderator: Madeleine Glick, Columbia University

12:00 - 13:30 Networking Lunch
13:30 - 14:30

Session 3: Metrics Discussion

Moderator: Tom Hausken, OSA

14:30 - 15:00 Coffee Break
15:00 - 16:30

Session 4: Manufacturing Embedded Photonics

Moderator: Robert Blum, Intel


16:30 - 17:00

Session 5: Workshop Wrap-up

17:00 - 18:30 Networking Reception

*times are subject to change

Featured Presentations

Session 1:  Data Center Requirements and Technology Roadmap

An efficient supply chain is among the foremost challenges for a company moving from initial product design and prototyping to volume manufacture. Current photonic supply chains tend to be highly-fragmented, greatly limiting the ability of many companies to bring their new products to market. These keynote presentations bring in-depth perspectives on existing photonic supply chains and challenges encountered to develop and manufacture products, from design and chip fabrication, through to packaging and test. Speakers will provide details of their experience in establishing supply chains and what essential factors are required to ensure advanced photonic products can be brought to market in a fast and cost-effective way.


Hitesh Ballani, Microsoft


Alexis Black Björlin, Broadcom

Larry Dennison, NVIDIA

Sun Min, Tencent

Sandeep Razdan, Broadcom

Session 2:  Embedded Photonic Products for Future Data Centers

Semiconductor manufacturing is commonly viewed as a set of distinct and linear steps: design, chip fabrication, packaging, and test (including reliability testing).  These steps may be managed as an entirely internal operation, or as a supply chain of internal and contracted operations.  How do companies make choices to keep operations internally or outsource it to contractors?  How does the manufacturer keep the supply chain coherent if it’s divided among different locations and vendors yet so interdependent?  How do you find and convince partners to work with your company?  This panel will present perspectives from different parts of the supply chain. 


Madeleine Glick, Columbia University


Darius Bunandar, Lightmatter

Thomas Liljeberg, Intel

Ted Schmidt, Juniper

Greg Young, Cisco (Luxtera)


Session 3: Metrics Discussion

This session will bring perspectives on performance and engineering targets for embedded photonics from  various programs and the working lunch discussions.  It will be an opportunity to hear from experts, compare the targets, and for a group discussion aimed at drafting a consensus roadmap. 


Tom Hausken, OSA


David Chen, Applied Optoelectronics

Richard  Grzybowski, MACOM

Gordon Keeler, DARPA

Peter O'Brien, PIXAPP, Tyndall Institute


Session 4: Manufacturing Embedded Photonics

Current integrated photonic manufacturing capabilities are fragmented, making it difficult for product developers to build their own reliable manufacturing supply chain. To address this, the session will provide a comprehensive overview of established and emerging integrated photonic manufacturing Topics to be addressed include design, wafer foundry, packaging and testing, and the challenges which have to be overcome to provide users with a seamless manufacturing supply chain.


Robert Blum, Intel


Phillipe Absil, IMEC

Ken Giewont, Global Foundries

Twan Korthorst, Phoenix/Synopsys

Sven Otte, Sicoya

Session 5: Workshop Wrap-up

This final session of the day will solicit perspectives from speakers and attendees on the key takeaways of the day.  


Tom Hausken, OSA



Image for keeping the session alive