Schedule
Schedule
PECC Summit - Optica+APC Photonic-Enabled Cloud Computing Summit
20 - 21 October 2026
HPE Aspiration Dome
Sunnyvale, CA UNITED STATES
Monday, 19 October 2026
| Time | Event | ||||
|---|---|---|---|---|---|
| 18:00 |
Welcome Dinner hosted by Optica + APC The Laughing Monk We invite you to join us for dinner and networking at The Laughing Monk. Meet with other industry leaders in a casual and unique environment the night before the event starts! |
Tuesday, 20 October 2026
| All scheduled events, except reception and welcome dinner, are at: HPE Aspiration Dome 1081 Innovation Way Sunnyvale CA, 94089 |
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|---|---|---|
| Time |
Events & Presenters |
Affiliations & Program Notes |
| 8:15–9:00 | Welcome Breakfast | |
|
9:00–9:15 |
Welcome & Opening Remarks |
|
Session 1: Architecting AI Infrastructure: The Hyperscaler and Compute Platform Perspective |
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| As AI systems scale to unprecedented size, the relationship between compute and networking is being fundamentally redefined. This opening session brings together leading hyperscalers and compute platform providers to explore how future AI infrastructure is evolving across scale-up, scale-out and scale-across domains; where optical connectivity is becoming essential; and what the photonics ecosystem must deliver to support the next generation of AI factories. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 9:15-10:45 |
Sr Director - Photonics | AMD Data Center Optics Engineer | Google Optical Network Engineer | Meta Principal Hardware Architect Optical Technologies | Microsoft Azure Hardware Systems & Infrastructure Architect – Physical Networking | Oracle |
|
| 10:45–11:30 | Coffee Break | |
Session 2: The Optical Scale-Up Frontier: Connecting the Next Generation of AI Systems |
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| As AI systems scale beyond the practical limits of conventional electrical I/O, a new generation of optical interconnect architectures is emerging to connect accelerators, memory and compute across increasingly large scale-up domains. This session will explore emerging approaches to optical scale-up, from co-packaged optical I/O and 3D photonic interposers to massively parallel microLED and terahertz-class optical interconnects. It will examine how these distinct architectural approaches can deliver the bandwidth density, reach, manufacturability and system-level integration required to scale future AI infrastructure | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 11:30–13:00 |
Vice-President & General Manager - Optical Interconnect | ams OSRAM Senior Vice-President Engineering & Operations | Lightmatter Chief Technology Officer & Co-Founder | Ayar Labs Vice-President – Sales & Marketing | Avicena Chief Executive Officer | Mojo Vision Chief Executive Officer & Founder | AttoTude |
|
| 13:00–14:15 | Lunch | |
Session 3: Architecting AI Fabrics: Scale-Up, Scale-Out and Beyond |
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| As AI infrastructure scales from tightly coupled accelerator clusters to distributed AI factories, networking is becoming one of the defining elements of overall system architecture. This session will explore how AI fabrics are evolving across scale-up, scale-out and emerging scale-across domains, and examine the architectural choices shaping next-generation connectivity. From Ethernet, merchant silicon and photonic fabrics to optical I/O and advanced interconnect technologies, the discussion will consider how complementary networking approaches can deliver the capacity, scalability and operational flexibility required by future AI infrastructure. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 14:15–15:30 |
Chief Architect | Arista Networks General Manager and Vice President – Optical Systems Division | Broadcom Sr Director – Product Management – Photonic Fabric Business Unit | Marvell Senior Vice President & Head of Product | Credo Vice President – Systems Architecture | Ciena |
|
| 15:30–16:15 |
Coffee Break |
|
Session 4: Architecting the AI Network: Scale-Up, Scale-Out and Beyond |
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| As AI networks demand greater connectivity across racks, clusters and datacentres, the optical layer must evolve in capacity, density, reach and manufacturability. This session will examine the roadmap from next-generation optical engines and modules to increasingly integrated photonic architectures, and ask what must change across technology, manufacturing and the supply chain to deliver them at hyperscale. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 16:15–17:15 |
Chief Technology Officer | Coherent Corp Chief Technology Officer | Lumentum Senior Vice President – Optical Modules | Nokia |
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| 17:15–17:30 | Wrap up Jose Pozo |
CTO | Optica |
| 17:30 | Bus Transportation to Reception Location - TBD | |
Wednesday, 21 October 2026
| All scheduled events, except reception and welcome dinner, are at: HPE Aspiration Dome 1081 Innovation Way Sunnyvale CA, 94089 |
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|---|---|---|
| Time |
Events & Presenters |
Affiliations & Program Notes |
| 8:00–8:40 |
Welcome Breakfast |
|
| 8:40-8:45 | Welcome Remarks Jose Pozo |
|
Session 5: Rethinking AI Infrastructure: Optical Switching and Photonic Acceleration |
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| As photonics moves deeper into AI infrastructure, its role is expanding beyond point-to-point connectivity. Emerging optical circuit switching technologies promise to dynamically reconfigure how data moves between compute resources, while photonic computing architectures are exploring whether light can also transform how AI workloads are processed. This session will examine how optical switching and photonic acceleration could reshape future AI systems, and what is required to move these technologies from specialized architectures towards deployment at scale. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 8:45-10:15 |
Chief Executive Officer & Co-Founder | Salience Labs Chief Technology Officer & Founder | Lumotive Senior Vice President & US General Manager | Lightelligence Chief Executive Officer & Founder | Q.ANT |
|
| 10:15-11:00 |
Coffee Break |
|
Session 6 - Advanced Materials, Devices and Components for Next-Generation Optical Infrastructure |
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| As optical technologies move closer to compute and into increasingly integrated AI architectures, continued innovation at the materials, device and component level will be essential. This session will explore how emerging photonic platforms, advanced light sources, detectors and highly integrated optical components can overcome the limitations of conventional technologies and enable new generations of optical interconnects. It will examine the path from device-level innovation to manufacturable, system-ready solutions, and the role of new materials and integration approaches in improving performance, scalability and functionality across future AI infrastructure. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 11:00-12:30 |
Vice-President – Marketing | Terahop Chief Executive Officer & Co-Founder | Quintessent Chief Executive Officer | POET Technologies Co-Founder, Chief Scientist, and Chief Technology Officer | Artilux Inc |
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| 12:30-13:45 | Lunch | |
Special Program: Industrializing Photonics for AI Infrastructure — From Foundry to High-Volume Manufacturing |
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As photonics moves deeper into AI infrastructure, the industry's focus is shifting from demonstrating performance to delivering manufacturable technologies at the scale, cost and reliability required for widespread deployment. Across CPO, NPO, OCS, LPO and emerging optical scale-up architectures, success will depend on an increasingly complex manufacturing ecosystem spanning foundries, advanced packaging, automated assembly, fiber connectivity, test and high-volume production. This special afternoon program will bring together leaders from across the photonics and semiconductor manufacturing value chain to examine how the industry moves from innovation to industrialization. It will explore where manufacturing bottlenecks remain, how foundries and packaging ecosystems must evolve, and what is required to build a resilient, scalable supply chain capable of supporting the next generation of AI infrastructure. |
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Session 7 – Scaling Integrated Photonics: From Foundry to Advanced Packaging |
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| The ability to manufacture integrated optical technologies at semiconductor scale is becoming increasingly critical. This session will bring together leading foundries to examine how silicon photonics platforms, heterogeneous integration and advanced packaging are evolving to support next-generation optical interconnects. It will explore the path from specialist photonic processes to high-volume manufacturing, including the challenges of yield, process standardization, design enablement, packaging and test, and ask what the foundry ecosystem must deliver to support future AI infrastructure at scale. | ||
| Time | Events & Presenters | Affiliations & Program Notes |
| 13:45-15:15 | Senior Fellow (Vice President) – Silicon Photonics Product Line | GlobalFoundries Senior Principal Engineer and Director – CPO Pathfinding and Technology | Intel Foundry Business Development Executive – Chiplets and Advanced Packaging | IBM Vice President and General Manager of Photonics | Jabil |
|
| 15:15-15:45 | Coffee Break | |
Session 8: Industrializing Photonics: From Innovation to High-Volume Manufacturing |
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The next challenge for photonics is not simply proving that new optical architectures work, but establishing how they can be assembled, tested, connected and manufactured at scale. As CPO, NPO, OCS, LPO and optical scale-up technologies move towards deployment, the industry must address practical challenges spanning optical alignment, fiber attach, detachable connectivity, automated assembly, test, yield, capital equipment and supply-chain integration. This session will bring together companies working across the manufacturing ecosystem to share practical perspectives on the transition from prototype to production. It will examine how automation, passive and active alignment, scalable fiber-to-chip connectivity, high-throughput test and new manufacturing partnerships can reduce cost and accelerate deployment, while maintaining the reliability and serviceability required for AI infrastructure. |
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| Time | Events & Presenters | Affiliations & Program Notes |
| 15:45–17:15 |
Chief Technology Officer - Computing and Transportation Business Group | BizLink General Manager | Molex Senior Director of IC/Packaging | Socionext US |
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| 17:15 | Conclusion of Event | |
