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2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March, 2021
In-person Event - Eastern Time (US & Canada) (UTC -05:00)

Philippe Absil

Vice President R&D, Head of the 3D and Silicon Photonics Technologies Department, IMEC

Alexis Black Björlin

Senior Vice President and General Manager of the Optical Systems Division, Broadcom

Robert Blum

Director, Strategic Marketing & Business Development , Intel Corporation

Darius Bunandar

Founder and Chief Scientist, Lightmatter

David Chen

AVP of Transceiver Technology & Strategic Marketing, Applied Optoelectronics, Inc. (AOI)

Larry Dennison

Director of Network Research, NVIDIA

Ken Giewont

Fellow - Technology Development, GLOBALFOUNDRIES

Madeleine Glick

Senior Research Scientist, Columbia University

Richard Grzybowski

General Manager of Silicon Photonics, Lightwave Business Unit, MACOM

Tom Hausken

Senior Industry Advisor, The Optical Society

Gordon Keeler

Program Manager in the Microsystems Technology Office (MTO), Defense Advanced Research Projects Agency,DARPA

Daniel Kilper

Research Professor, Optical Sciences, CIAN, University of Arizona

Twan Korthorst

Director, Synopsys Photonic Solutions, Phoenix/Synopsys

Thomas Liljeberg

General Manager, Photonic Integration; Silicon Photonics Products Division, Intel

Sun Min

Optical Architect, Tencent

Peter O'Brien

Director, European Photonics Packaging Pilot Line (PIXAPP) & Head of Photonics Packaging Group, Tyndall Institute

Sven Otte

CEO, Sicoya

Sandeep Razdan

Senior Principal Engineer in the Optical Systems Division (OSD), Broadcom

Ted Schmidt

Distinguished Engineer, Silicon Photonics, Juniper

Mark Filer


Sylvie Menezo

SCINTIL Photonics

Anu Agarwal

Massachusetts Institute of Technology

Vikas Gupta


Rob Stone


Yi Qian

MRSI Systems & Mycronic

Nick Harris


Image for keeping the session alive