Optica Online Industry Meeting: Enabling High-Volume Photonic Integration w/ Advanced Packaging
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12 May 2026 10:00 - 11:30
Eastern Daylight/Summer Time (US & Canada) (UTC -04:00)
Sponsors:
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Join our online industry meeting on Enabling High-Volume Photonic Integration through Advanced Packaging, where leaders from foundries, OSATs, equipment vendors, and system integrators will tackle one of the biggest challenges in scaling photonic integrated circuits (PICs): packaging. This session brings together experts to explore advances in co-packaging, wafer-level packaging, heterogeneous integration, automation, and testing, alongside cross-industry insights from datacom, sensing, quantum, and biomedical applications.
Participants will gain a deep understanding of the technical and supply chain strategies driving industrialization, cost reduction, and scalable manufacturing, positioning their organizations to take advantage of the next generation of high-volume PICs.
Technology Integrators
Greg May
Jabil Photonics | Sr. Director R&D
Greg May is Jabil’s senior director of R&D for photonics. He joined Jabil in 2021 and is responsible for all advanced packaging activities at the company’s Ottawa, Canada, site. Greg began his career at Bell-Northen Research, working on some of the first-ever 10 Gb/s amplified line systems. He then took a series of roles at organizations in the photonics and technology industries throughout Canada and the United Kingdom, including Innovance Networks, Bookham/Oclaro Paignton, Innovate UK, and Ruskinn Technology. Immediately prior to joining Jabil, Greg returned to Canada as Ciena’s senior advisor for product line management in the merchant modem and pluggable coherent transceiver space.
Greg earned a Bachelor of Engineering in Electrical Engineering from the University of Saskatchewan and a Master of Science in Electrical Engineering from the University of Alberta.
Sandeep Sane
Lightmatter | Sr. Director, Head of Packaging
Dr Sandeep Sane is Senior Director and Head of Packaging at Lightmatter, where he drives the strategy and execution of advanced packaging technologies for the company’s cutting-edge Passage and LASER product lines. With over two decades of industry leadership, Sandeep brings deep expertise in semiconductor packaging, system architecture, and high-performance computing platforms.
Prior to Lightmatter, he served as a Principal Engineer at Intel, where he played a pivotal role in developing silicon-package co-design methodologies and led key innovations in manufacturing, reliability, and cost optimization. He is a co-inventor of Intel’s industry-leading EMIB packaging technology, holding more than 30 patents and a strong track record of publications and leadership in the field.
Sandeep began his career at IBM’s Microelectronics Division and holds a Ph.D. and M.S. from Caltech, along with a B.S. from IIT Bombay. He is an active member of ASME and a recognized voice in the semiconductor packaging community.
Technology Enablers
Moderators
