Optica Online Industry Meeting: Enabling High-Volume Photonic Integration w/ Advanced Packaging

12 May 2026 10:00 - 11:30
Eastern Daylight/Summer Time (US & Canada) (UTC -04:00)

(Registration will open soon)

Join our online industry meeting on Enabling High-Volume Photonic Integration through Advanced Packaging, where leaders from foundries, OSATs, equipment vendors, and system integrators will tackle one of the biggest challenges in scaling photonic integrated circuits (PICs): packaging. This session brings together experts to explore advances in co-packaging, wafer-level packaging, heterogeneous integration, automation, and testing, alongside cross-industry insights from datacom, sensing, quantum, and biomedical applications.

Participants will gain a deep understanding of the technical and supply chain strategies driving industrialization, cost reduction, and scalable manufacturing, positioning their organizations to take advantage of the next generation of high-volume PICs.