Advancing Scalable Photonic Integration with Heterogenous Integration
25 November 2025 10:00 - 11:00
Eastern Time (US & Canada) (UTC -05:00)
Local Time:
Join us for a look at the latest breakthroughs in scalable photonic circuits and wafer-scale integration. Discover how combining diverse materials and active components is pushing the boundaries of design flexibility, performance, and real-world applications—from next-generation computing and sensing to quantum technologies and advanced communication systems.
Join us for a look at the latest breakthroughs in scalable photonic circuits and wafer-scale integration. Discover how combining diverse materials and active components is pushing the boundaries of design flexibility, performance, and real-world applications—from next-generation computing and sensing to quantum technologies and advanced communication systems.
Attendees of this industry tutorial will gain insights into how high-speed modulators and photodetectors with exceptional responsivity are being seamlessly integrated into standard PIC platforms—advances that are shaping the future of photonics innovation.
Sponsored By:
Speaker
Michael Geiselmann
Michael Geiselmann, Co-Founder, President, and CCO of LIGENTEC SA, is a physicist and engineer who advanced frequency comb research at EPFL and built an international photonic integration company spanning Switzerland, France, and Belgium.
Moderator
