300-mm Monolithic CMOS Silicon Photonics Foundry Technology

The ever-burgeoning bandwidth demands of data center infrastructure are driving the need for optical transceivers that deliver higher performance, scalability, and cost efficiency beyond 200G/lamda. Monolithic silicon photonics, which enables large-scale integration of photonic and electronic components on a shared SOI substrate, has emerged as a key enabler in meeting these requirements. This talk will provide an overview of GlobalFoundries' Fotonix™ platform - the industry’s first high-volume 300mm monolithic CMOS SiPh foundry offering.

The webinar will highlight critical challenges and recent innovations in low-loss passive components (Si/SiN waveguides, cWDMs, edge and grating couplers, MMIs, polarization handling structures, and WDMs) and high-performance active devices (germanium photodetectors, Mach-Zehnder and microring modulators). It will also cover progress in heterogeneous integration and packaging technologies, including passive V-groove fiber attach, pluggable I/O couplers, hybrid laser integration, Cu pillar, and TSV structures. The talk will also briefly touch on the co-integrated CMOS capabilities, including high-speed TIAs, drivers, and supporting mixed-signal and digital libraries that enhance the functionality of the SiPh platform. The presentation will conclude with a perspective on GlobalFoundries’ silicon photonics roadmap and how continued innovation is driving adoption across diverse application spaces beyond data centers.

Subject Matter Level: Advanced - Assumes a strong understanding of the topic

What You Will Learn: 

• Key innovations and challenges in developing high-performance passive and active silicon photonics components on a 300mm monolithic CMOS platform.
• Advanced packaging strategies including fiber attach, pluggable couplers, and hybrid laser integration to enable scalable optical I/O.
• Insights into GlobalFoundries’ silicon photonics roadmap and its role in addressing future demands beyond data centers.

Who Should Attend: 

• Researchers, academic professionals, and engineers working in optics, photonics, optoelectronics, and biomedical engineering
• Graduate students

About the Presenter: Yusheng Bian from GlobalFoundries

Dr. Yusheng Bian is a Distinguished Member of Technical Staff and Director at GlobalFoundries in Malta, NY, where he leads the silicon photonics device team, driving innovation in passive/active components, optical I/O, and monolithic integration on the Fotonix™ platform. His team delivered key technologies including CMS90WG and 45SPCLO, and played a pivotal role in qualifying GlobalFoundries’ 300mm SiPh platform.

Dr. Bian has authored over 150 publications, two book chapters, and holds 260+ granted patents with 300+ pending. He has received multiple honors, including the SRC Mahboob Khan Outstanding Liaison Award, GlobalFoundries Master Inventor, Triple Diamond Inventor Award, Diversity in Inventorship Champion Award, and the USPTO Appreciation Award. He earned his Ph.D. in Optical Engineering from Beihang University and conducted postdoctoral research at Penn State and Peking University.