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Using Ultrafast Spectroscopic Imaging for Material Characterization from the Micron to Wafer Scale


This webinar is hosted By: Applied Spectroscopy Technical Group

28 August 2025 15:00 - 16:00

Eastern Daylight/Summer Time (US & Canada) (UTC -04:00)

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Advanced materials research powers the miniaturization and increased performance of devices vital to our connected and electrified world. In this webinar hosted by the Applied Spectroscopy Technical Group, Torben Purz will demonstrate how ultrafast imaging, with its hyperspectral, hypertemporal, and volumetric capabilities, can benefit material characterization. The webinar will explore applications ranging from flakes of 2D material to process engineering in compound semiconductor manufacturing.

Subject Matter Level: Intermediate - Assumes basic knowledge of the topic

What You Will Learn:
• How spectroscopy can be used in the characterizing of semiconductor materials
• What range of information ultrafast spectroscopy can provide in material interrogation
• How ultrafast lasers can be used to inform on the performance of electronic devices

Who Should Attend:
• Students and early career scientists in spectroscopy and semiconductor fields interested in learning more about the role of spectroscopy in electronics
• Senior scientists interested in growing collaborations or learning about new spectroscopic techniques
 

About the Presenter: Torben Lennart Purz from MONSTR Sense Technologies

Dr. Torben Purz currently serves as a lead research scientist at MONSTR Sense Technologies in Ann Arbor, MI where he leads research and development of optical imaging devices for semiconductor characterization and inspection. Torben joined MONSTR Sense Technologies after completing his Ph.D. in Physics at the University of Michigan in 2023, where he was a Fulbright scholar, and focused on developing novel spectroscopy and imaging techniques to investigate two-dimensional materials. His expertise spans nonlinear microscopy, four-wave mixing, and ultrafast and pump-probe spectroscopy.

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