Optica Online Industry Meeting: Photonics Packaging, Assembly and Testing
29 August 2022 10:00 - 12:00Eastern Time (US & Canada) (UTC - 05:00)
Attendees, including assembly and test service providers and tool/equipment manufacturers, will discuss the packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal considerations or volume vs price.
Click here to view the current attendee list (as of 29 August 2022 10 AM ET).
Peter De Dobbelaere
Program Manager, Defense Advanced Research Projects Agency (DARPA)
President and Founder, TechSearch
Peter De Dobbelaere received the Ph.D. degree in integrated optics from the University of Gent, Belgium in 1995. From 1991 to 1995 he was employed by IMEC. From 1995 to 1999, he was with Akzo-Nobel N.V., The Netherlands and U.S.A., where he was engaged in development of polymer-based photonic ICs. In 1999, he joined OMM Inc., San Diego, CA, where he was responsible for product and technology development of MEMS-based optical switches. In 2004, he joined Luxtera, Inc., Carlsbad, CA, where he was responsible for technology and product development for silicon photonics based transceiver products. In 2019 Luxtera Inc. was acquired by Cisco Systems Inc. where he now continues his work as Cisco Fellow in the Client Optics Group.
Dr. Gordon Keeler joined DARPA in August 2017 as a Program Manager in the Microsystems Technology Office (MTO). His objective is to accelerate the development of emerging photonics, electronics, and integration technologies to open new pathways toward revolutionary optical microsystems. Prior to joining DARPA, Dr. Keeler was a Principal Member of Technical Staff at Sandia National Laboratories. At Sandia, his research focused on the creation of advanced optoelectronics and heterogeneous integration techniques to prototype solutions for optical sensing, imaging, communications, and high-performance computing applications. His technical interests include semiconductor lasers, modulators, and detectors; nanophotonics and plasmonics; semiconductor materials and device physics; radio frequency (RF) and ultrafast optics; novel photonic materials and their integration with mature platforms; and microscale optoelectronic packaging technologies.
Gordon Morrison is Vice President of Engineering at Freedom Photonics (a Luminar Company) where he leads laser and photonic integrated circuit development from epitaxial design through packaging. Gordon has 25 years of experience developing and qualifying photonics components and modules for applications ranging from telecommunications to remote sensing and atomic clocks.
Jim Theodoras is currently VP of R&D at HG Genuine USA, where he oversees the design and manufacture of optical transceivers for data communication applications. He has over 30 years of industry experience in electronics and optics, spanning a wide range of diverse topics. Jim is a past President of the Ethernet Alliance and past optical liaison editor for IEEE Communications Magazine, and is a frequent contributor to industry publications, standardization efforts, and MSAs.
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI and IMAPS. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.