Thursday 18 December Speakers
TH1 – 9:00 (Keynote)
Silicon photonic transmitters for low energy, & high bandwidth, Graham Reed, Optoelectronics Research Centre, University of Southampton, UK. There is much discussion around how the industry requirements for 200Gbd Silicon Photonics transmitters will be met. Should other materials be incorporated within the Silicon platform for higher speed or will this result in additional contamination and consequential manufacturing difficulties? In the paper, our recent work on all-silicon solutions will be discussed, together with recent results in which 200GBd has been demonstrated.
TH2 – 9:30 (Invited)
Photonic-Electronic Integration Platform on Glass Waveguide Substrates with 3D-Printed Micro-Optics, Yasutaka Mizuno, Sumitomo Electric Industries, ltd., Japan. We propose a photonic-electronic integration platform on glass substrates for the next generation of CPO. We have demonstrated optical coupling between PICs and glass waveguides using a 3D-printed vertically-coupled beam-expanding lens and photonic wire bonding.
TH3 – 9:50 (Invited)
Fabrication of GI core single-mode and multimode polymer optical waveguide using resins with high index contrast, Masahiro Karakawa, Ajinomoto Co., Inc. and Keio University, Japan. In this paper, we fabricate GI-core single-mode and multimode polymer optical waveguides with remarkably high Δ applying newly developed resins with high index contrast to the Mosquito Method and present their high optical confinement.
TH4 – 10:10 (Contributed)
Combining Two-Photon Grayscale Lithography and Injection Molding for High-NA Micro-Optics Production, Leander Siegle1*, StefanWagner2,3, Stephan Haeusler3, Philipp Flad1, Mario Hentschel1, Thomas Günther2, André Zimmermann2,3, and Harald Giessen1, 14th Physics Institute and Research Center SCoPE, University of Stuttgart, Pfaffenwaldring 57, 70569 Stuttgart, Germany; 2Institute for Micro Integration (IFM), Faculty 7 - Engineering Design, Production Engineering and Automotive Engineering, University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany; 3Hahn-Schickard, Allmandring 9B, 70569 Stuttgart, Germany. This work combines two-photon polymerization grayscale lithography, electroplating, and injection molding to replicate complex micro-optics with high precision, enabling scalable production of arbitrary geometries and closing the gap between advanced prototyping and industrial-scale manufacturing.
TH5 – 11:00 (Keynote)
High precision optics in Life Science Applications, Ulrike Fuchs, Fraunhofer IOF, Asphericon, Germany. High-precision optics are key to life science advances. Let’s explore how aspheres, freeform optics, and tailored beam shaping improve imaging, diagnostics, and laser-based techniques by enhancing resolution, efficiency, and system performance.
TH6 – 11:30 (Invited)
Laser processing in GHz regime: one source does it all, Laura Gemini, ALPhANOV, France. Femtosecond laser processing in GHz burst regime has gained a lot of attention in the last few years thanks to its unique capability of achieving higher control over thermal effects during laser-material interaction. This feature allowed the development of new processing techniques in fs regime that were not yet accessible leading to more efficient manufacturing and new applications. Here, three different implementations of this technique are presented to highlight the agility of such processing approach, that is (i) the production of moulds for microfluidic devices, (ii) high-throughput generation of TGVs and (iii) surface treatment of 3D parts through robot-assisted fibre-delivered laser machine. In all presented works, the employed laser source is a Satsuma X from Amplitude running at 50 W maximum average power at 1030 nm wavelength.
TH7 – 11:50 (Invited)
Advanced Glass Waveguide Solutions for High-Density Photonic Packaging and Interconnects, Lars Brusberg, Corning Optical Communications, Germany. A photonic packaging solution is presented based on a glass waveguide substrate for interconnecting optical fibers and silicon photonic chips. The advanced glass waveguides are manufactured using an ion-exchange (IOX) process and combined with design improvements for low-loss optical fan-outs for high density interconnects. The photonic integrated chip (PIC) is flip-chip assembled and interconnected through low-loss evanescent coupler.
TH8 – 13:00 (Keynote)
Decoding Cancer with Light: Raman and FTIR Spectroscopy for Early Detection and Treatment Monitoring, Fiona Lyng, Radiation and Environmental Science Centre, Technological University Dublin, Ireland. This talk presents recent advances in Raman and FTIR spectroscopy for early cancer detection and treatment monitoring using minimally invasive samples, such as exfoliated cells and biofluids.
TH9 – 13:30 (Invited)
Ten Years of Lab on Fiber Technology: Perspectives and Challenges, Andrea Cusano, University of Sannio and the Optoelectronics and Photonics Research Center for Life Science (Cnos), Italy. 2,000 years ago, Hippocrates recognized that “The right therapy depends exclusively on the right diagnosis.” He thus anticipated what we now call the era of personalized medicine, in which treatments are selected on the basis of individual molecular markers in order to obtain a precise diagnosis and find the right treatment for the right patient at the right time. In this context, Lab on fiber technology was introduced ten years ago as a promising key enabling technology aimed to develop new theranostic devices that can be integrated into the working channels of mini-invasive clinical instruments (needles, catheters and nano-endoscopes) for in vivo liquid and tissue biopsy, supporting light-assisted local therapies. After one decade, new functionalities and unprecedented performances have been achieved connected with relevant milestones and significant breakthroughs, showing that lab on fiber technology is much more than a simple vision, especially when personalized life sciences are envisaged as a target application area. In this report, we review the technological roadmap that lie ahead the Lab on fiber concept with a major focus on the actual technological barriers, main perspectives towards translation in clinical practices and main challenges to be faced in next future.
TH10 – 13:50 (Invited)
Mid-Infrared Photonic Integrated Circuits: From Concepts to Commercialization, Ryszard Piramidowicz, Warsaw University of Technology & VIGO Photonics, Poland. Mid-infrared photonic integrated circuits (MIRPICs) hold transformative potential for Europe’s photonics industry, opening new opportunities in environmental and industrial monitoring, digital health, agri-food, automotive, and Internet of Things applications. This talk will discuss the technological, industrial, and market challenges of developing a scalable MIRPIC platform, drawing on recent progress achieved within the HyperPIC project. Particular emphasis will be placed on the transition from research to manufacturing, supply-chain resilience, and Europe’s pathway toward technological sovereignty in integrated photonics.
TH11 – 14:10 (Contributed)
Scalable fabrications of meta-fibers with applications in biomedical imaging, Fei He1*, Rafael Fuentes-Domínguez1, Richard Cousins2, Christopher J. Mellor3, Andrew Daniel Rocha4, Zuzana Adams4, Jennifer K. Barto 4,5, and George S.D. Gordon1, 1Optics and Photonics Group, Faculty of Engineering, University of Nottingham, Nottingham NG7 2RD, United Kingdom; 2Nanoscale and Microscale Research Centre, University of Nottingham, Nottingham, NG7 2RD, United Kingdom; 3School of Physics and Astronomy, University of Nottingham, Nottingham, NG7 2RD, United Kingdom; 4Wyant College of Optical Science, University of Arizona, Tucson, Arizona 85721, USA; 5Biomedical Engineering, University of Arizona, Tucson, Arizona 85721, USA. We will discuss a scalable fabrication method for meta-fibers, and imaging results to show its compatibility with imaging applications such as OCT. This will enable advanced diagnosis via biomedical imaging techniques with minimal invasiveness.
TH12 – 15:00 (Keynote)
Advancements in data storage using integrated lasers and plamonic lensing, Richard Pitwon, Seagate, Ireland. In this talk we provide an update on Heat Assisted Magnetic Recording (HAMR), which requires highly dense integration of a laser onto photonic integrated circuits coupled to a plasmonic lens, all co-packaged along with other photonic and magnetic components into an area no larger than 0.3 mm2 on a rapidly moving recording head. HAMR therefore enables the most advanced and high-volume co-packaged optical subsystems ever developed. We will also discuss future advances beyond HAMR.
TH13 – 15:30 (Invited)
Development and applications of next-generation high energy and high peak power lasers, Mariastefania De Vido, STFC Central Laser Facility, UK. We discuss DiPOLE, the world-leading high energy, high pulse rate laser amplifier technology. We describe its use for the realisation of petawatt peak power lasers driving particle and radiation sources for industry, healthcare and security.
TH14 – 15:50 (Invited)
Optical Chiplet Structure Based on MCeP®, Yuji Furuta, Shinko Electric Industries Co., Ltd., Japan. We propose the optical chiplet structure based on the high-density packaging technology MCeP®*. This design incorporates a reinforced structure that supports the fiber array, achieving both low optical coupling loss and high adhesive strength.
TH15 – 16:10 (Contributed)
AFM-IR Characterization of Nano-Fabricated Multilayer Pillars for Advanced Nanoscale Sensing, Yide Zhang1,2,3, Ufuk Yilmaz1, Artem S. Vorobev2,3*, Simone Iadanza4, Liam O’Faolain2,3, Bernhard Lendl1, and Georg Ramer1,5, 1Institute of Chemical Technologies and Analytics, TU Wien, Vienna, 1060, Austria; 2Centre for Advanced Photonics and Process Analysis, Munster Technological University, Cork, T12P928, Ireland; 3Tyndall National Institute, Cork, T12R5CP, Ireland; 4Laboratory of Nano and Quantum Technologies Paul Scherrer-Institut, Villigen, 5232, Switzerland; 5Christian Doppler Laboratory for Advanced Mid-Infrared Laser Spectroscopy in (Bio-)process Analytics, TU Wien, Vienna, 1060, Austria. We combine nano-fabricated multilayer pillar samples, AFM-IR experiments, and analytical–numerical modeling to show how absorber size, position, and topography govern signal intensity and resolution, informing nanoscale optical sensing and integrated photonic device design.
