Laser Congress

03 October 2021 – 07 October 2021
Optica Virtual Event - Eastern Daylight/Summer Time (UTC - 04:00)

Laser Applications Conference Program

Monday, 4 October
08:00-10:00 Joint Plenary Talks

Steve Rummel, II-VI Incorporated 

11:00 - 13:00

Laser-Based Additive Manufacturing

Organizer: Thomas Grunberger, Plasmo Industrietechnik GmbH, Austria

Additive manufacturing is a fast growing segment and well known since many years. Especially laser technology which has enabled us to develop new manufacturing processes in the last few decades. Are we in the phase of a second hype of this technology or are we at the step from prototyping to industrial production? There are few missing topics bringing additive manufacturing to broad industrial application. They are missing standards, time consuming qualification of the process, quality assurance and automation. The session will give an overview about the state of standards and presents actual and future possibilities of insitu monitoring and post process quality assurance systems for qualification of AM processes.

16:00 - 18:00

THz Sources & Applications

Barry Behnken, AEye, Inc., USA

Terahertz (THz) technology deals with the generation and utilization of electromagnetic energy, covering what is also known as the sub-millimeter wave region of the spectrum. In this region, which lies between the millimeter wave and far infrared spectral regions, materials exhibit properties that can be exploited to advantage for use over a broad range of important technologies and applications.  This session brings together researchers and engineers from academia, industry, and government laboratories to explore sources and applications of work in the frequency range covering approximately less than 1 GHz (300 mm) to greater than 3 THz (100 μm).

Tuesday, 5 October
07:00 - 09:00

EUV and X-Ray Generation & Particle Acceleration

Organizer: Lahsen Assoufid, Argonne National Laboratory, USA

The rapid progress in extreme-power laser technology opened a path to the development of a new generation of small-scale EUV, X-ray, and Gamma-ray light sources with unprecedented brightness and short pulses. These sources, which could fit on a tabletop or in a small-scale laboratory, will revolutionize many industrial, research, medical, defense, and security applications. Their development relies on the progress in laser technology and performance. This session will give an update on the latest development, needs and challenges in high-power laser technologies tailored to methods for short (EUV, X- and Gamma-ray) wavelength generation (laser-produced plasma, high harmonic generation, inverse Compton scattering), and laser plasma acceleration.

09:30 - 11:30

Laser Induced Damage Test

Organizer: Danijela Rostohar, Institute of Physics of the ASCR, HiLASE Centre, Czech Republic    

In the era of new generation high intensity lasers and their application, development and testing of new optical components and their coatings plays a crucial importance. Laser Induced Damage Threshold (LIDT) measurements are an essential part in understanding a very complex mechanism of damage occurrence. LIDT is a function of various parameters including laser wavelength, pulse duration, pulse repetition frequency, spot size, temporal and spatial profile, and angle of incidence. The purpose of this session is to bring attention to existing limitations in development of optical components and their coatings as well as requirements for establishing new techniques and standards on their LIDT testings.

12:30 - 14:30

Laser Shock Peening

Organizer: Danijela Rostohar, Institute of Physics of the ASCR, HiLASE Centre, Czech Republic  

Laser peening has great potential to prolong the service life of various products and components, and is expanding the application area based on the advancement in high-power laser technology. The purpose of this session is to provide a forum for exchanging the latest results of research, development and innovation in laser peening and related technologies including high power lasers, new processes such as adhesion/damage testing, laser interaction models and application to different types of materials and components with emerging interest.  

Wednesday, 2 October
06:00 - 08:00

Surface Modification and Micromachining

Organizer; Heather George, TRUMPF Inc., USA

Lasers are a critical tool in creating surface modifications to control mechanical or chemical interactions. From cleaning to remove contaminants in preparation for welding to creating a surface texture that has an increased surface area for adhesion, lasers give an unparalleled degree of control. This control is also essential for micromachining, since the very small or thin parts are easily distorted by any type of warp or burr. This session will focus on the latest capabilities of lasers, scanners and processes to control fine structures for emerging market applications.

09:00 - 11:00

Lasers for Mobility

Organizer: Umar Piracha, AEye, Inc., USA

In the past decade, there has been a strong interest in the development of technologies for autonomous mobility applications, such as self driving trucks, cars, drones and robots. The global self driving cars and trucks market size is expected to expand at a compound annual growth rate of 63.1% from 2021 to 2030. A crucial component of such systems is the laser, and properties such as high output power, low power consumption, small form factor, eye safety, and low cost are required to make this vision a reality. This session offers a series of invited talks covering novel laser designs, lidar architectures & laser requirements, and the latest results from some of the leading lidar companies working this area.

12:00-13:30

14:00-15:30

Brittle Materials I & II

Organizer: Dirk Mueller, Coherent Inc., USA

Brittle materials pose a significant challenge to mechanical machining. Mechanical processing can introduce micro-cracks, chips and be limited in the geometries. Lasers have a unique advantage in processing a variety of brittle materials as their wavelengths and pulse durations can be tailored to optimize the material interaction. Brittle materials such as glass and sapphire are increasingly benefitting from laser processing. The session will discuss novel laser-based methods to weld brittle materials without frit and discuss new methods of cutting silicon or glass whilst maintaining maximum bend strength and edge fidelity.

15:00-16:30

Submicron Material Processing

Organizer: Ruth Houbertz, ThinkMade Engineering and Consulting, Germany

The processing of submicron structures using lasers is a continuously growing field due to its wide applicability. Laser micromachining is a versatile processing technology, providing access to many applications and novel product features. Dependent on the kind of laser and the types of materials which are used in the processes, either functional surfaces or functional structures can be created on a sub-micron scale down to the 100 nm scale additively or subtractive. This session will focus on materials and processing for photonic and medical applications and the related markets.